Instrument development in MIRSL requires detailed microwave engineering and digital systems knowledge. Rather than working on just one component of an instrument, we work with the system as a whole, making tradeoffs where necessary in the overall design in order to optimize the system to work for its particular application.
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A CAD drawing of a Ka-band board inside of its mechanical housing. This particular layout is used to maximize the isolation between two channels of downconvesion, while sharing the same Local Oscillator. | ||
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A CAD assembly drawing for a complicated mechanical/microwave board layout. The lower board contains telemetry and DC power, while the upper board houses microwave components. | ||
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A 3 kW, Extended Interaction Kllystron (EIK; a tube whose housing is painted red) and the High Power Voltage Supply (right of picture), which dwarfs the Ka-band EIK in size and weight. | ||
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A two-channel, 3 GSamp/channel ADC complete with Xilinx 4 FPGA. This particular board was constructed with all space qualifiable parts and is capable of streaming data to disk at a minimum rate of 200 MSamp/second. | ||
