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Engineering Academy of Southern New England
University of Massachusetts

ABSTRACTS OF UMASS ACADEMY PROJECTS

button Project 1999: Partnership in Recruitment of Anglo/Minority Girls into Engineering
The underrepresentation of women and minorities in science and engineering remains a national concern which the Engineering Academy of Southern New England proposes to address as one of the four goals of the NSF grant. Specifically, the Academy will design programs and activities which will encourage underrepresented female minorities, and Anglo female women students to study and eventually practice in the engineering profession.

button Development of New Freshman Engineering Program at UMass, Amherst
This proposal describes a new two semester freshman course whose objectives are to introduce engineering concepts and develop an appreciation of manufacturing. The use of team-oriented design for manufacturing projects and the development of high level communication skills are emphasized.

button Integrating Manufacturing into a Senior Computer Systems Design Lab
This proposal describes the development of: 1) manufacturing modules, and 2) an inter-university Design Forum, for a required senior-level Computer Systems Design Laboratory course in Electrical and Computer Engineering. The five manufacturing modules will consist of video-taped lectures, software and other teaching materials covering: the economics of electronic system manufacturing, microprocessor system design, printed circuit board design and use of programmable logic. Design projects allow students to apply knowledge from the modules to a small microprocessor based system, typically for control or signal processing. The final Design Forum presents an opportunity for students to present their systems to an industrial panel which will give awards based on manufacturability and design innovation.

button Multimedia Teaching Materials for Electronic Design Software
Novel multimedia teaching materials will be developed to allow students to learn modern electronic design methods while addressing manufacturing issues. The materials will be built around three commercial computer-aided design (CAD) software packages which support logic design, microcontroller design, and printed circuit board design, from industrial partners Altera, Microchip and PADs, respectively. The materials will consist of videos, written materials and software design examples, much of which will be available on the World Wide Web for broad dissemination. This is a continuation and expansion of an earlier effort supported by industry and the Academy for integrating manufacturing into upper-level computer design courses.

button Intelligent Manufacturing Tutor Development
We are developing three-dimensional interactive computer environments of several manufacturing processes to help students understand the complexity of manufacturing design and the need for expertise to reduce tooling costs. We are working on the module for injection molding and intend to have that ready for testing by Summer and Fall of 1995. The module for die casting is also almost complete. In Fall 1995 we will begin the module for stamping and possibly in the following year the module for sand casting.

button Product Realization Curriculum Support
The curriculum support needed to sustain a new integrated mechanical engineering design curriculum based on one coherent theme of product realization is described. The curriculum support requested includes production of a video documentation of the product realization process, development of a mentoring program, an electronic design library, prototyping capabilities, animation and virtual prototyping material, and a two semester product realization course with a library of videotaped modules to support the course.

button Design for Quality (DFQ) Project
Three one-credit modules will be developed in conjunction with several companies and professional societies to provide a systematic overview of manufacturing through the concepts and tools of Design for Quality (DFQ). Emphasis is on the role of quality in the total production cycle, including customer inputs, competitive benchmarking, performance specifications, product and process design, manufacturing variability and product reliability. Students will learn software tools and complete DFQ exercises and industry-based projects, with emphasis on teamwork and problem solving. The modules can be offered at upper levels, or combined as a stand alone course for freshmen and sophomores. All modules will be taught in the 1995/1996 academic year.

button Development of Electronics Manufacturing Engineering Instructional Materials for ECE Sophomores and Juniors
In this manufacturing-across-the-curriculum proposal, we outline our plans for developing novel electronics manufacturing instructional materials to be used in core ECE sophomore and junior courses at UMass Amherst as well as other institutions. In Phase 1 of this proposal, we plan to develop novel sophomore level course materials on semiconductor fabrication, packaging and manufacturing techniques starting at the integrated circuit level. These materials will be developed with assistance from industry experts for use in existing courses on digital electronics and semiconductor devices and materials. Starting during the Spring 95 semester, these new lecture materials will be videotaped, thus providing easy portability to other EASNE institutions.

button An Interdisciplinary Multi-Campus Senior Design Project for Manufacturable Electronics Products
The purpose of this project is to develop an educational methodology for interdisciplinary senior design projects focused on manufacturable and marketable electronics products, using senior design teams at UMass Amherst and UConn. In particular, we envision a joint effort between Electrical Engineering senior design teams at UMass Amherst, and Computer Science and Engineering senior design teams at UConn. For a given product design, the Amherst students would lead on the electronics hardware design and the Storrs students would lead on the software design. The joint team would emphasize design of a novel electronics product for manufacturablility and marketability.

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